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HCC602S
Small footprint
Wide temperature range: -190C to 600C
Sample sizes: 3mm up to 50mm
Silver surfaces
Optional floating surfaces.
HCC SQUARE WAFER CHUCKS
Square sample area to accommodate various sample sizes and shapes
Better integrate into some experimental workspaces
S (grounded), SF (floating), or ST (triaxial) options
Multi vacuum zones for different wafer sizes
Optional cooling down to 80K
Optional triaxial for pA current measurements
TEC BASED SQUARE WAFER CHUCKS
Thermoelectric cooling and heating
Square shape accommodates various sample sizes and shapes
Cooling down to -30°C without using LN2
Multi vacuum zones for different wafer sizes
Optional triaxial for pA current measurements
HCC ROUND WAFER CHUCKS
Round thermal wafer chucks
Designed for wafer handling
Modern electrical probing and testing
Multi vacuum zones for different wafer sizes
Optional cooling down to 80K
Optional triaxial for pA current measurements
PSM-VP1 Suction Pump
Standalone 1-zone suction pump for securing samples to thermal chucks
-75 kPa maximum suction pressure
Universal input voltage
PSM-VP4 multi-zone suction pump
Convenient 4-zone suction pump for securing samples to thermal chucks
individually selectable suction zones for securing different sized samples
-50 kPa maximum suction pressure split between 4-zones