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Tabletop design with small footprint integrate with modern instruments and benches
-190°C - 1000°C depending on model
Variable sample size
Sealed chamber with gas purging or vacuum capability
4 independent electrical probes with remote positioning
VACUUM BENCHTOP PROBE STATIONS
PRODUCT INQUIRY -
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MODELS
• TP102V-PS Series operates from -40°C to 180°C with thermoelectric cooling and heating and vacuum options, sample area 40x40mm
• HCP402V-PS Series operates from -190°C (with liquid N2 cooling) to 400°C (with resistive heating) with vacuum, sample area 50x50mm
• HP1000V-PS Series operates from 35°C to 1000°C with resistive heating only, and supports both gas purging and vacuum, sample area 50x50mm
• CUSTOM Series available to achieve lower and higher temperatures and custom features for any application, wafer size up to 300mm
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STRUCTURAL FEATURES
Sample Area
Fits 10 mm-300 mm wafers and devices
Chamber Height
6 mm
Probe Positioning
XYZ micropositioners remotely manipulate probes within sealed sample chambers with 20 mm fine travel
Atmosphere Control
Gas purging or vacuum capability to control humidity, condensation, and oxidation
Frame Cooling
Integrated frame cooling via hose barb ports with optional chiller system
Frame Dimensions
1060 mm x 600 mm x 213.2 mm
Weight
20 kg, aluminum or stainless steel options
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OPTICAL FEATURES
Optical Access
Reflection capability via large window
Optical Windows
Removable and exchangeable windows permit full-spectrum transparency
Minimum Objective Working Distance
25 mm
Top Window
50 mm diameter
Top Viewing Angle
±40° from normal
Window Defrost
Integrated external window defrost
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ELECTRICAL FEATURES
Electrical Probes
Standard tungsten-rhenium DC probes with other probe options available
Probe Positioning
XYZ micropositioners remotely manipulate probes within sealed sample chambers with 20 mm fine travel
Connectors
Coaxial, floating, or triaxial BNC connectors
Sample Surface
Grounded, floating, or triaxial options
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THERMAL FEATURES
Temperature Control
mK2000 with programmable precision LVDC PID method to minimize electrical noise
Thermal Block
Aluminum, Silver, or Ceramic options for superior thermal uniformity
Temperature Resolution
0.01°C (RTD) or 0.1°C (Themocouple ) Temperature Stability
±0.05°C at 100°C
Power Supply
115 V or 230 V depending on region
Software
Windows software to record and export temperature-time data
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APPLICATIONS
• Characterize electrical behavior of thin films, 2D materials, nanomaterials, and molecular/organic electronic devices
• Electrically grounded, floating, or triaxial options for the thermal block surfaces and triaxial BNC connectors
• DC electrical probe options in tungsten-rhenium, beryllium-copper, or other materials
• Remotely manipulate probes in sealed chambers with XYZ positioning
• Test components of wafers, semiconductor devices, integrated circuits, printed circuit boards, photovoltaics, LC’s, and LED’s
• Measure IV and CV characteristics, breakdown voltage, leakage current, resistance, dielectric strength, and diode efficiency