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Round Hot And Cold Chuck Systems
 
Features
· Precision Temperature Control from -100°C to 310°C
· Low Surface Temperature Gradients
· Independent Vacuum Channels for Small or Large Wafer Sizes
· Thin Design for Easy Probe Station Integration
· Lift Pin Access Holes Available
· Triaxial Option Available for Very Low Leakage/Noise Measurements
· Grounded, Coaxial (Floating) and Triaxial (Guarded) Chuck Surfaces Available
· Controlled Fast Heating and Cooling Rate
· Options for On Chuck and Off Chuck Independent Vacuum Channel Control Available
· Wafer Size from 12 mm to 304 mm
Technical Specifications
Temperature Resolution
0.01°C with mK1000
Temperature Stability
±0.05°C at 100°C with mK1000 (better stability optional)
Temperature Uniformity
±0.1°C per cm (better temperature uniformity available)
Minimum Heating and Cooling Rate
±0.1°C per hour
Temperature Control Method
Switching PID (PID with Linear Variable DC optional)
Temperature Control Sensor
100 Ω Platinum RTD
Surface Flatness
10 µm at ambient temperature
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